Design, implement, and manage Integrated Circuit (IC) product bring-up, verification, and characterization programs for NPI, including ATE test programs, load boards, and probe cards using ATE platforms such as UFLEX or 93K. Drive test development, validation, and characterization for high-speed interfaces including DDR memory and High-Speed I/O (HSIO) IPs, ensuring production screen enabement and low Defective Parts Per Million (DPPM).
Collaborate with vendors and internal teams to engineer high-volume ATE manufacturing solutions tailored for advanced packaging. Execute product and DPPM correlation between ATE and system-level environments for new products, and enhance test coverage and resolve the failure modes via rigorous troubleshooting on ATE and SLT systems. Direct production sustaining activities, including program upgrades, yield optimization, test time reduction, lot disposition, and RMA analysis.
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