Drive end-to-end system architecture, technology roadmap, and board-level design for next-generation platforms, establishing technical direction and design standards. Lead multi-disciplinary trade-off analyses across system, mechanical, thermal, and PCB layout teams to define high-density interconnect strategy, stackup architecture, and routing guidelines. Architect Power Delivery Networks (PDN) and high-speed signal pathways with SI/PI experts, establishing guidelines that ensure robust performance at hyperscale.
Lead execution and technical design reviews with JDM/CM partners, implementing engineering changes to accelerate project delivery. Lead cross-functional engineering initiatives with Silicon, Firmware, Software, Thermal, Mechanical, and Operations teams to deliver cohesive, scalable infrastructure solutions. Influence manufacturing and vendor roadmaps to optimize design for manufacturing and design for test for high-volume, enterprise-grade deployments.
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