Drive end-to-end system architecture, technology roadmap, and board-level design for next-generation platforms, establishing technical direction and design standards across programs. Lead multi-disciplinary trade-off analyses across system, mechanical, thermal, and PCB layout teams to define high-density interconnect strategy, stackup architecture, and complex routing guidelines. Architect power delivery networks (PDN) and high-speed signal pathways in partnership with SI/PI experts, establishing guidelines that ensure performance at hyperscale.
Oversee lab validation strategy, system bring-up, and root-cause analysis for critical architectural issues, mentoring engineering teams through complex debugging. Lead cross-functional engineering initiatives with Silicon, Firmware, Software, Thermal, Mechanical, and Operations teams to deliver cohesive, scalable infrastructure solutions. Influence manufacturing and vendor roadmaps to optimize Design for Manufacturing (DFM) and Design for Test (DFT) for high-volume, enterprise-grade deployments.
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