Senior Staff Advanced Packaging Design Engineer

Location: Burlington, VT

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal, and system requirements of next-generation High-Performance Computing (HPC), Artificial Intelligence (AI), and networking solutions.

The team focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability. This work involves high-speed signaling and complex power delivery networks (PDNs) that require innovative and customized solutions to meet constantly evolving customer needs.

Many of these new designs require multi-chip, multi-component configurations, including but not limited to 2.5D and 3D packages, co-packaged copper or optical solutions, and advanced substrates.

Marvell has partnered with the world's leading manufacturers to solve our customers' most challenging design and integration problems through industry-leading packaging technologies.

What You Can Expect

• Lead small project teams of design and simulation engineers to deliver innovative, high-quality packaging solutions.
• Drive package definition and architecture development for performance-line products utilizing cutting-edge packaging technologies.
• Interface with package suppliers to select appropriate packaging technologies and ensure manufacturability, while meeting performance, reliability, and cost requirements.

What We're Looking For

• Extensive experience in substrate and/or board design for advanced packaging technologies.
• Solid understanding of design-for-manufacturing (DFM) and reliability principles, as well as electrical performance considerations, with the ability to make appropriate trade-off decisions.
• Proven ability to lead complex package architecture development projects involving relevant internal stakeholders, external partners, and customers.
• Expertise in industry-standard tools and workflows, including Cadence 3DIC, ISP, APD, and SiP.
• Bachelor's degree in Electrical Engineering or a related field with 5+ years of relevant professional experience; Master's degree or Ph.D. with 3+ years of relevant professional experience.
• Additional Locations: US-MA - Westborough, US-AZ - Chandler