Job Description and Requirements
At Synopsys, we drive innovations that shape the way people work and live. As a member of the Applications Engineering team, you will work closely with semiconductor, advanced packaging, AI infrastructure, and electronics system customers to enable next-generation product development through simulation, digital engineering, and AI-driven workflows.
This role combines deep engineering expertise, customer engagement, and solution consulting. You will help customers deploy industry-leading simulation technologies, engineering automation platforms, and AI-enabled design workflows to accelerate innovation across semiconductor packaging, AI servers, high-performance computing (HPC), and complex electronic systems.
The ideal candidate possesses strong technical knowledge in simulation technologies, excellent communication skills, and practical experience working with semiconductor manufacturers, OSATs, or leading system companies.
Key Responsibilities
Technical Consulting & Customer Success
- Provide technical leadership and application support for simulation-driven design and engineering workflows.
- Work directly with customer engineering teams to understand design challenges and develop effective technical solutions.
- Deliver software evaluations, proof-of-concepts (PoCs), benchmarks, and customer demonstrations.
- Support strategic accounts and help customers maximize the value of Synopsys solutions.
- Drive customer adoption and deployment of advanced simulation methodologies.
Semiconductor & Advanced Packaging Applications
Support semiconductor and advanced packaging customers in solving complex thermo-mechanical and reliability challenges.
Develop application methodologies for
Advanced Packaging
CoWoS
Chiplet Architectures
Hybrid Bonding
Fan-Out Packaging
AI/HPC Package Development
Warpage Prediction
Thermo-Mechanical Reliability
Stress Analysis
Fatigue and Life Prediction
Material Characterization
Process-Induced Deformation
AI-Driven Engineering & Workflow Automation
Collaborate with customers to establish AI-powered engineering workflows and automation frameworks.
Drive adoption of AI-assisted simulation and design optimization technologies.
Support implementation of
Engineering Automation
AI Agents for Engineering Applications
Design Exploration
Machine Learning-based Optimization
Digital Engineering Platforms
Develop workflow automation solutions using scripting and programming tools such as Python.
Multi-Physics Simulation & System Design
Apply simulation technologies across
Structural Analysis
Thermal Management
Computational Fluid Dynamics (CFD)
Vibration and Dynamic Analysis
Electronics Cooling
System-Level Engineering
Assist customers in developing digital twin and model-based engineering methodologies.
Cross-Functional Collaboration
- Work closely with R&D, Product Management, Sales, and Global Applications Engineering teams.
- Provide technical feedback and market requirements to product development organizations.
- Participate in customer visits, executive meetings, technical workshops, and industry conferences.
- Contribute to technical publications, best practices, and knowledge-sharing activities.
Requirements
Education
M.S. or Ph.D. degree in
Mechanical Engineering
Materials Science
Aerospace Engineering
Electrical Engineering
Computer Engineering
Applied Physics
Experience
- 5+ years of industry experience in semiconductor, advanced packaging, electronics systems, simulation software, or related engineering fields.
- Hands-on experience supporting engineering teams in semiconductor manufacturing, OSAT, IC design, HPC, AI server, electronics, or system development environments.
- Experience interacting with customers in technical consulting, application engineering, or solution deployment roles is highly preferred.
Technical Qualifications
Candidates should possess experience in one or more of the following areas:
Simulation Technologies
Finite Element Analysis (FEA)
Structural Mechanics
Reliability Engineering
Fatigue Analysis
Vibration & Dynamics
Multi-Physics Simulation
Semiconductor & Packaging
Advanced Packaging Technologies
Chiplet Integration
Heterogeneous Integration
Thermal/Mechanical Reliability
Wafer-Level Packaging
Package Warpage
Manufacturing Process Simulation
AI and Engineering Automation
Engineering Workflow Automation
AI/ML Applications for Engineering
Surrogate Modeling
Design Space Exploration
Data Analytics
Python Programming
AI Agents / LLM-enabled Engineering Workflows
Computing Environment
Linux Environment
HPC Clusters
Parallel Computing
Cloud-based Engineering Platforms
Preferred Qualifications
- Experience with Synopsys, Ansys, Abaqus, Siemens, Cadence, or equivalent engineering simulation platforms.
- Knowledge of AI infrastructure, GPU systems, server design, or data center technologies.
- Experience in model-based systems engineering (MBSE), digital twins, or digital engineering initiatives.
- Familiarity with semiconductor ecosystem leaders, foundries, OSATs, and electronics manufacturing workflows.
- Strong presentation skills with the ability to communicate complex technical concepts to both engineering and executive audiences.
- Self-driven, customer-focused, and capable of leading highly visible technical engagements.
- Success in This Role
A successful candidate will
Become a trusted technical advisor to key semiconductor and electronics customers.
Drive adoption of simulation-led product development methodologies.
Enable AI-driven engineering transformation initiatives.
Influence next-generation semiconductor packaging and system design technologies.
Help customers accelerate innovation while improving product reliability, engineering productivity, and time-to-market.
At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.
Job description provided by Synopsys.
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