TYLsemi Technology/Software

Senior Staff Engineer – RV (EM/IR)

Bengaluru, India In person Full-time

Role Overview

We are looking for an experiencedSenior Staff Engineer –RV(EM/IR)to lead power integrity and reliability signoff activities for advanced-node SoC designs. In this role, you will drive IR drop and electromigration (EM) analysis, define signoff methodologies, and collaborate with cross-functional teams to achieve robust and reliable silicon implementation. The ideal candidate shouldpossessdeepexpertisein power integrity analysis,strongunderstanding of advanced-node challenges, and proven experience in leading signoff closure for complex chip designs.

WhatYou’llDo

  • Lead full-chip and block-level IR drop and electromigration (EM) analysis for advanced-node SoC designs
  • Drive power integrity signoff closure byidentifying, debugging, and resolving IR/EM violations
  • Collaborate with Physical Design, Power, Package, and Foundry teams to optimize power delivery networks
  • Define and improve EM/IRmethodologies, automation flows, and signoff strategies
  • Perform static and dynamic IR analysis across multiple operating conditions and scenarios
  • Analyze power grid robustness, current density, and thermal impacts to ensure design reliability
  • Supporttapeoutactivities and ensure high-quality signoff delivery within project timelines

WhatWe’reLooking For

  • 10+ years of experience in IR/EM analysis, power integrity, or Physical Design signoff
  • Bachelor’s orMaster’sdegree in Electronics, Electrical Engineering, or VLSI-related discipline
  • Strong understanding of power integrity concepts including static/dynamic IR drop, EM analysis, and power grid optimization
  • Hands-on experience with industry-standard tools such as CadenceVoltus, Ansys RedHawk, or equivalent
  • Good understanding of Physical Design flow includingfloorplanning, placement, CTS, routing, and extraction
  • Strong scripting skills inTcl, Python, Perl, or Shell for automation and flow development
  • Good to Have
  • Experience with advanced technology nodes such as 7nm, 5nm, 3nm, or below
  • Exposure to package-aware analysis, thermal analysis, and low-power methodologies
  • Experience in leading signoff closure for large-scale SoC or high-performance compute designs
  • Success in This Role Looks Like
  • Achieving robust IR/EM signoff with minimal iterations and successfultapeoutexecution
  • Early identification and resolution of power integrity risksimpactingperformance and reliability
  • Improved signoff productivity throughmethodologyenhancements and automation initiatives
  • Strong technical leadership and collaboration across implementation and signoff teams

Location

Hybrid / On-site – Bengaluru

Job description provided by TYLsemi.
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