- Work closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing
- Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes
- Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment
- Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations
- Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions
- Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences
- Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts
- Test, troubleshoot and recommend improvements to advanced packaging assembly equipment
- Identifies, analyzes and resolves system design weaknesses
- Bachelors Degree preferred in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging;
- 2+ years of experience in a related field;
- Knowledge of the semiconductor packaging is a plus;
- Hands-on, strong aptitude and deep understanding of highly advanced machinery;
- Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) or semiconductor manufacturing highly preferred;
- Strong data analysis skills
- Candidates with higher qualifications may be considered for a more senior position
- Position to be located in Rio Rancho (New Mexico)
Job description provided by Kulicke & Soffa.
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