Define and execute Google's long-term technology roadmaps for PCBA assembly, including qualifying advanced, high-density component packaging for future product generations. Author, standardize, and maintain Google’s proprietary PCBA Design Guidelines for rigid and rigid-flex assemblies, setting the benchmark for hardware manufacturability. Lead the technical gatekeeping and execution of the OK2FAB layout approval workflow, conducting critical, high-risk CAD layout reviews to mitigate manufacturing risks before fabrication.
Serve as the engineering DRI for high-stakes SMT defect investigations, applying analytical lab techniques to resolve complex assembly failures and recover factory yields during NPI and mass-production ramps. Define engineering standards for panel array designs, panelization routing clearances, allowable x-out thresholds, and SMT process traceability parameters.
Job description provided by Google.
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